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  4. The Use of Dmaic Process in Printed Circuit Board Assembly Industry
 
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The Use of Dmaic Process in Printed Circuit Board Assembly Industry

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Author(s)
Sakulpipat, Thassaporn
Teeravaraprug, Jirarat
Publisher(s)
University of the Thai Chamber of Commerce
Date Issued
2007
Resource Type
Text::Conference output::Conference proceedings::Conference paper
Language
English
Abstract
Six Sigma has been viewed as a successful methodologyof process improvement and variation reduction. Thefundamental objective of the Six Sigma methodology isthe implementation of a measurement-based strategy thatfocuses on process improvement and variation reductionthrough the application, which can be accomplished bythe use of Six Sigma DMAIC process. The Six SigmaDMAIC process (define, measure, analyze, improve,control) is a process eliminating defects (driving towardssix standard deviations between the mean and nearestspecification limit) in any process – from manufacturingto transactional and from product to service. This paperpresents the application of using Six Sigma in a PrintedCircuit Board Assembly industry (PCBA). Based on theobservation, the main problems of the PCBA case studywas incurred in the surface mount technology (SMT)process. The problem includes mainly in quality problem.The use of Six Sigma DMAIC process is applied to shrinkthe problem. Based on the study, it is proof that Six Sigmais an effective tool to increase in product quality.
Subject(s)
Engineering (General)
Journal
Proceedings of the 2nd International Conference on Operations and Supply Chain Management
Conference
The 2nd International Conference on Operations and Supply Chain Management
Access Rights
public
Rights
This work is protected by copyright. Reproduction or distribution of the work in any format is prohibited without written permission of the copyright owner.
Rights Holder
University of the Thai Chamber of Commerce
Bibliographic Citation
Thassaporn Sakulpipat, Jirarat Teeravaraprug (2007) The Use of Dmaic Process in Printed Circuit Board Assembly Industry.
URI
https://hdl.handle.net/20.500.14437/870
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Acquisition Date
Sep 26, 2024
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